2-5-13-4F Nakagawa-Chuo Tsuzuki-ku Yokohama Kanagawa 224-0003 Japan
Phone : +81-45-590-3838
E-mail : sales@tpt-japan.com

Tabletop Semiautomatic / manual wire bonder
This is very flexible and precise tabletop wire bonding machine.
TPT offers both wedge and ball bonding possibilities without changing bond head.
Also easy operation is great feature of TPT, so this is best solution for R&D.
TPT : http://www.tpt.de/

Compact reflow solder system
Unitemp offers compact and low price reflow solder system. Detail temperature
set up is available not only for heating but also cooling. Many options will support you With flexible and various reflow process including vacuum and N2 surroundings.
Unitemp: http://www.unitemp.de/EN/website/home/welcome/

Semiautomatic / manual Sub-Micron Die Bonder
This machine is a flexible sub-micron bonder used for precise placement,die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications.
FINTECH: http://eu.finetech.de/

Productronica @ Munich Germany
Nov 15 ~ 18 2011

IC Packaging Technology EXPO @ Tokyo Big sight, Japan
Jan 18 ~ 20 2012